Codsiga Warshadaha Semiconductor
GREEN waa shirkad heer qaran ah oo heer caalami ah oo u heellan R&D iyo soo saarista isu imaatinka qalabka elektiroonigga ah iyo baakadaha iyo qalabka tijaabada. U adeegida hoggaamiyeyaasha warshadaha sida BYD, Foxconn, TDK, SMIC, Canadian Solar, Midea, iyo 20+ shirkado kale oo Fortune Global 500 ah. Lamaanahaaga aad ku kalsoon tahay ee xalalka wax soo saarka horumarsan.
Mashiinnada isku-xidhka ayaa awood u siinaya isku-xidhka-yar ee dhexroorka siliga, hubinta daacadnimada calaamadaha; alxanka faakuumka faakuumka formic acid wuxuu sameeyaa kalagoysyo lagu kalsoonaan karo oo hoos yimaada oksijiinta <10ppm, ka hortagga fashilka oksaydhka ee baakadaha cufnaanta sare; AOI waxay ka hortagtaa cilladaha heerka-yar. Isku-dhafkan wuxuu hubinayaa> 99.95% wax-soosaarka baakadaha horumarsan, isagoo buuxinaya shuruudaha tijaabada aadka u daran ee 5G/AI chips.
Ultrasonic Wire Bonder
Awood u leh isku-xidhka 100 μm-500 μm silig aluminium ah, 200 μm-500 μm silig naxaas ah, xargaha aluminium ilaa 2000 μm ballaaran iyo 300 μm dhumucdiisuna, iyo sidoo kale xargaha naxaasta ah.
Qiyaasta safarka: 300 mm × 300 mm, 300 mm × 800 mm (la beddeli karo), oo leh dib-u-celin <± 3 μm
Qiyaasta safarka: 100 mm × 100 mm, oo leh dib u soo celin <± 3 μm
Waa maxay Tignoolajiyada Isku-xidhka Wire?
Isku xidhka siliggu waa farsamada isku xidhka microelectronic ee loo isticmaalo in lagu xidho qalabka semiconductor ee baakaddooda ama substrates. Iyada oo ah mid ka mid ah tignoolajiyada ugu muhiimsan warshadaha semiconductor, waxay awood u siineysaa isku-xirnaanta wareegyada dibedda ee aaladaha elektiroonigga ah.
Isku-xidhka Qalabka Siliga
1. Aluminium (Al)
Wanaajinta korantada sare vs. dahab, kharash-ool ah
2. Copper (Cu)
25% korantada/kulka ka sarreeya Au
3. Dahab (Au)
conductivity ugu fiican, iska caabin daxalka, iyo isku halaynta isku halaynta
4. Silver (Ag)
Dhaqdhaqaaqa ugu sarreeya ee biraha dhexdooda
Aluminium Wire
Aluminium Ribbon
Siliga Copper
Ribbon Copper
Semiconductor Die Bonding & Wire Bonding AOI
Wuxuu adeegsadaa kamarad warshadeed oo 25-megapixel ah si uu u ogaado cilladaha ku-xidhka dhinta iyo cilladaha ku xidhidhiyaha siligga ee alaabada sida ICs, IGBTs, MOSFETs, iyo xargaha rasaasta, isaga oo gaarey heerka ogaanshaha cillad ka weyn 99.9%.
Kiisaska Kormeerka
Awood u leh in uu baaro dhererka jajabka iyo fidsanaanta, jajabka, leexinta, iyo jajabinta; kubbadda alxanka ee aan la isku dhejin iyo goynta wadajirka ah; ciladaha isku xidhka siliga oo ay ku jiraan dhererka wareegyada xad-dhaafka ah ama aan ku filnayn, dunta wareegga, fiilooyinka jaban, fiilooyinka maqan, xidhiidhka siliga, foorarsiga siliga, goynta siddo, iyo dhererka dabada xad-dhaafka ah; xabagta aan ku filnayn; iyo biro saytuun.
Kubadda Iibka/Hadhaaga
Xaqashada Chip
Meelaynta Chip, Cabbirka, Jeexitaanka Meas
Wasakhowga Chip/Alaab shisheeye
Chipping
Jeexjeexyada dhoobada
Wasakhaynta Dhuumaha dhoobada
AMB Oxidation
In-line Formic Acid Dib-u-qulqulaya Foornada
1. Heerkulka ugu sarreeya ≥ 450°C, heerka faakuumka ugu yar <5 Pa
2. Waxay taageertaa aashitada formic iyo habraaca nitrogen
3. Hal dhibic maran ≦ 1%, guud ahaan heerka faaruqa ≦ 2%
4. Biyaha qaboojinta + qaboojinta nitrogen, oo ku qalabaysan nidaamka qaboojinta biyaha iyo qaboojinta xiriirka
Semiconductor Power IGBT
Heerarka faaruqinta xad dhaafka ah ee alxanka IGBT waxa ay dhalin kartaa guuldarrooyinka silsilada falcelinta oo ay ku jiraan kulaylka cararka, dildilaaca farsamada, iyo hoos u dhaca waxqabadka korantada. Hoos u dhigista heerarka faaruqa ah ilaa ≤1% waxay si weyn u wanaajisaa isku halaynta aaladaha iyo hufnaanta tamarta.
IGBT habka socodka wax soo saarka
